The Surface Mount Technology to make the advancement of applicant and research within the technical circuit of knowledge. Surface mount is a process of creating Electronic circuits in which the components are fitted directly onto the surface of printed circuit boards. It can be used to Reducing component cost and Increase level of performance. In this electronic device is also called surface mount devices. SMT also provides improved shock and vibration resistance due to their components.
Types of Surface Mount Technology
There are three types of technology available for both active and passive surface mount components are attaching to Printed Board.
- Type I assemblies
- Type II assemblies
- Type III assemblies.
The Type I assembly is a complete SMT board with part two sides of the board.
The Type II assembly has a combination of through SMT components and Hole components. All the surface Mount chip components are placed on the secondary side of the Printed Board. Active some SMCs and DIPs are then located on the primary side. It requires soldering.
The Type III assembly is basically similar to Type II. Active SMCs chip also used on the secondary side but the DIPs are used on the primary side only.
Advantage- SMT
- Simpler Automated Assembly, Smaller components, Lower inductance and resistance at the connection
- Smaller holes need to be drilled through the PCB boards
- Components can be placed on two sides of the circuit boards
- Better Mechanical performance.
